Thermal Design of Electronic Equipment (Hardcover) (ISBN-13: 9780849300820)

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

Author: Ralph Remsburg
ISBN-10: 0849300827
ISBN-13: 9780849300820
Publisher: CRC Press
Language: English
Published: 09/27/2000
Pages: 396
Format: Hardcover
Weight: 1.58lbs
Size: 9.43h x 6.30w x 1.02d

Review Citation(s):
Scitech Book News 03/01/2001 pg. 158