Thermal Management of Microelectronic Equipment Heat Transfer Theory Analysis Methods, and Design Practices, 2nd edition (Hardcover) (ISBN-13: 9780791861097)

This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.

Author: Lian-Tuu Yeh
ISBN-10: 0791861090
ISBN-13: 9780791861097
Publisher: American Society of Mechanical Engineers
Language: English
Published: 06/01/2016
Pages: 524
Format: Hardcover
Weight: 1.91lbs
Size: 9.00h x 6.00w x 1.13d