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  • Interconnect Reliability in Advanced Memory Device Packaging by Gan
    Gan

    Interconnect Reliability in Advanced Memory Device Packaging

    Author: Gan, HuangISBN-10: 3031267079ISBN-13: 9783031267079Publisher: SpringerLanguage: EnglishPublished: 04/29/2023Pages: 210Format: HardcoverWeight: 1.30lbsSize: 9.37h x 6.30w x 0.71d
    $219.99
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