-
Vendor: Gan
Interconnect Reliability in Advanced Memory Device Packaging
Author: Gan, HuangISBN-10: 3031267079ISBN-13: 9783031267079Publisher: SpringerLanguage: EnglishPublished: 04/29/2023Pages: 210Format: HardcoverWeight: 1.30lbsSize: 9.37h x 6.30w x 0.71d- $219.99
$219.99- $219.99
- Unit price
- per

